Dr. Ruochen   Han
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Dr. Ruochen Han

Research Scientist
Micron Technology, Boise, Idaho


Highest Degree
Ph.D. in Chemical Engineering from University of Arizona, Tucson, Arizona, USA

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Area of Interest:

Engineering
100%
Thin Film Processing
62%
Semiconductor Technology
90%
Chemical Technology
75%
Chemical Reaction Engineering
55%

Research Publications in Numbers

Books
0
Chapters
0
Articles
0
Abstracts
0

Selected Publications

  1. Han, R., Y. Sampurno, Y. Zhuang, L. Borucki and A. Philipossian, 2017. Effect of conditioning and slurry application method on silicon dioxide removal rates using a ceria-based chemical mechanical planarization slurry. ECS J. Solid State Sci. Technol., 6: P477-P482.
  2. Han, R., Y. Sampurno, Y. Zhuang and A. Philipossian, 2017. Effect of various slurry injection system configurations on removal rates of silicon dioxide using a ceria-based chemical mechanical planarization slurry. ECS J. Solid State Sci. Technol., 6: P449-P454.
  3. Han, R., Y. Sampurno and A. Philipossian, 2017. Fractional in situ pad conditioning in chemical mechanical planarization. Tribol. Lett., Vol. 65. 10.1007/s11249-016-0803-7.
    CrossRef  |  Direct Link  |  
  4. Han, R., Y. Sampurno S. Theng, F. Sudargho, Y. Zhuang and A. Philipossian, 2017. Method for ultra rapid determination of the lubrication mechanism in chemical mechanical planarization. ECS J. Solid State Sci. Technol., 6: P32-P37.
    CrossRef  |  Direct Link  |  
  5. Han, R., Y. Sampurno S. Theng, F. Sudargho, Y. Zhuang and A. Philipossian, 2017. Application of the Stribeck+ curve in silicon dioxide chemical mechanical planarization. ECS J. Solid State Sci. Technol., 6: P161-P164.
    CrossRef  |  Direct Link  |  
  6. Han, R., Y. Mu, Y. Sampurno, Y. Zhuang and A. Philipossian, 2017. Effect of pad surface micro-texture on tribological, thermal and kinetic characterizations during copper chemical mechanical planarization. ECS J. Solid State Sci. Technol., 6: P201-P206.
    CrossRef  |  Direct Link  |  
  7. Mu, Y., R. Han, Y. Sampurno, Y. Zhuang and A. Philipossian, 2016. Effect of pad surface micro-texture on removal rate during tungsten chemical mechanical planarization. ECS J. Solid State Sci. Technol., 5: P345-P348.
    CrossRef  |  Direct Link  |  
  8. Mu, Y., R. Han, Y. Sampurno, Y. Zhuang L. Borucki and and A. Philipossian, 2016. Mean residence time and dispersion number associated with slurry injection methods in chemical mechanical planarization. ECS J. Solid State Sci. Technol., 5: P155-P159.
    CrossRef  |  Direct Link  |  
  9. Han, R., Y. Sampurno and A. Philipossian, 2016. Feasibility of a real-time method in determine the extent of pad break-in during copper chemical mechanical planarization. Tribol. Lett., Vol. 62. 10.1007/s11249-016-0671-1.
    CrossRef  |  Direct Link  |  
  10. Han, R., X. Wei, Y. Zhuang, Y. Sampurno and A. Philipossian, 2016. Method for accelerated diamond fracture characterization in chemical mechanical planarization. Microelectron. Eng., 149: 37-40.
    CrossRef  |  Direct Link  |