Mr. Deepak Puthal
Research ScientistCommonwealth Scientific and Industrial Research Organisation, Australia
Highest Degree
Ph.D. Student in Computer Science from University of Technology Sydney, Australia
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Biography
Mr. Deepak Puthal is PhD student in Faculty of Engineering and Information Technology, University of Technology Sydney, Australia. He has completed his Master of Technology in Computer Science and Engineering, National Institute of Technology (NIT) Rourkela, India. Previously he worked as Research Associate at Qatar Mobility Innovations Center and Teaching Assistant Professor at Department of Computer science and Engineering NIT Silchar, India. Mr. Deepak has 20 publications in journals and conferences. His main area of research interest focuses on Distributed Computing, Cloud Computing, Big Data Analytics, Information Security, and Wireless Networks. He is member of IEEE Computer Society and IEEE Young Professionals. Mr. Deepak is also serving as peer reviewer for IEEE Transactions on Computers, Future Generation Computer Systems, Information Sciences journal, IEEE Communications Magazine and IEEE Cloud Computing.
Area of Interest:
Selected Publications
- Puthal, D., S. Nepal, R. Ranjan and J. Chen, 2016. A dynamic prime number based efficient security mechanism for big sensing data streams. J. Comput. Sys. Sci., 10.1016/j.jcss.2016.02.005.
CrossRef | - Sahoo, B. P. S., S. Rath and D. Puthal, 2012. Energy efficient protocols for wireless sensor networks: A survey and approach. Int. J. Comput. Appl., 44: 42-48.
Direct Link | - Puthal, D., Sahoo, B. and S. Sharma, 2012. Dynamic Model for Efficient Data Collection in Wireless Sensor Networks with Mobile Sink 1. Int. J. Comput. Sci. Technol., 3: 623-628.
Direct Link | - Puthal, D., B. Sahoo and B.P.S. Sahoo, 2012. Effective Machine to Machine Communications in Smart Grid Networks. ARPN J. Sys. Software 2: 18-22.
Direct Link | - Sahoo, B. P. S., D. Puthal and S. Rath, 2011. An Energy Efficient Optimal Routing Method for Wireless Sensor Networks. ARPN J. Sci. Technol., 4: 558-564.
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